Organic Polysilazane Resins

Base polysilazane resins and liquid ceramic precursors — binders, clear varnishes and synthesis feedstock for SiCN, SiCNO and SiO2 systems. Full data per grade in the TDS, provided on request.

The grades

Grades in this family. Specifications are confirmed in the product TDS.

EK-1300

High-temperature curing polysilazane resin

Solvent-free heat-cured polysilazane binder and resin modifier; 5–7H, reactive with epoxy, isocyanate, amine and phenolic groups.

EK-1800

UV-curing polysilazane resin

Solvent-free UV-curing polysilazane; 80–85% ceramic yield, withstands 1000 °C peaks after ceramisation.

EK-S01 Transparent Silazane Varnish

EK-S01

Room-temperature curing transparent silazane varnish

Transparent RT-curing varnish for electronics, easy-clean and outdoor anti-corrosion.

EK-S02.1500 RC

Room-temperature fast-curing polysilazane resin

Solvent-free liquid polysilazane, fast ambient moisture cure; 6–8H, water contact angle 100–110°.

EK-S02.1500 SC Slow-Cure Polysilazane Resin

EK-S02.1500 SC

Room-temperature slow-curing polysilazane resin

Solvent-free liquid polysilazane, slow ambient moisture cure; 6–7H, water contact angle 100–110°.

EK-S03 Methylhydrogensilazane

EK-S03

High-temperature curing agent (methylhydrogen polysilazane)

Methylhydrogen polysilazane (MW >8×10⁴) — high-temperature curing agent and crosslinker.

EK-S04 Methylvinylsilazane

EK-S04

Methylvinylsilazane

Low-molecular silazane — amine curing agent and modifier for epoxy, alkyd, acrylic resins.

EK-S05 High-Molecular Polysilazane Binder

EK-S05

High-molecular polysilazane binder

Binder for steel coating systems; precursor for SiCN, SiCNO and SiO2 ceramics.

EK-S06 Polyborosilazane

EK-S06

Polyborosilazane resin

Film-former for self-cleaning anti-corrosive coatings; air cure below 200 °C, >6H.

EK-S08 Solid Polysilazane Resin

EK-S08

Solid polysilazane resin, high-temperature curing

Solid resin for ceramic-precursor routes, flame-retardant systems and HT adhesives.

EK-S10 Polyamide-Polysilazane Resin

EK-S10

Polyaluminosilazane resin

Polyaluminosilazane resin; >75% ceramic yield, also for ceramic-precursor routes.

EK-S11 Low-Molecular Polysilazane

EK-S11

Low-molecular methylhydrogen polysilazane

Low-molecular polysilazane (MW 177–591) for composites, impregnation and thin films.

EK-S1303

Solvent-based polysilazane, full cure in one day

Solvent-based low-viscosity polysilazane with the fastest full cure in the range — one day — and contact angle 105–110°.

Compare grades

How the grades in this family differ. Exact values are confirmed in each product TDS.

GRADE

FORM

MAX SERVICE TEMP *

CURING

TYPICAL USE

EK-1300

Solvent-free liquid resin

<500 °C in air

150–200 °C · 4–8 h

Heat-cure binder; reacts with epoxy and amine

EK-1800

Solvent-free liquid resin

<500 °C · 1000 °C peak

200–250 °C · 1–4 h

UV-curing binder, 80–85% ceramic yield

EK-S01

Liquid varnish

−30 to 500 °C · 800 °C peak

Ambient or 180 °C

Standard clear protective coat, ≥7H

EK-S02.1500 RC

Solvent-free liquid resin

<500 °C in air

Ambient · full cure 3–7 days

Fast-curing binder — full cure 3–7 days

EK-S02.1500 SC

Solvent-free liquid resin

<500 °C in air

Ambient · full cure 5–10 days

Slow-curing binder — longer open time

EK-S03

Liquid resin

−30 to 300 °C · 600 °C peak

180–250 °C · 1 h

High-temperature curing agent, MW >8×10⁴

EK-S04

Liquid resin

−30 to 400 °C · 800 °C peak

250 °C · 1.5 h

C=C reactive; addition-cure routes

EK-S05

Liquid precursor

−30 to 700 °C · 1000 °C peak

250 °C · 1 h

SiCN/SiO₂ ceramics, fibres, composites

EK-S06

Coating base

≤200 °C air · >850 °C in nitrogen

Air: ambient or 85 °C · N₂: >600 °C

Polyborosilazane self-cleaning anticorrosion

EK-S08

Solid granules

−30 to 800 °C

260 °C · 1 h

Powder routes; ceramic-yield work

EK-S10

Solid resin

−30 to 1000 °C · 1300 °C peak

250 °C · 1 h

Polyaluminosilazane, SiAlCN ceramics, ≥8H

EK-S11

Liquid resin

−30 to 400 °C · 800 °C peak

180–250 °C · 1 h

Low-MW grade — composites and impregnation

EK-S1303

Solvent-based liquid resin

500 °C in air

Ambient · full cure 1 day

Fastest full cure in the range — one day

* From each grade’s TDS. Final selection is confirmed during technical review.

Key properties

Typical properties of this family — exact values depend on product grade and are confirmed in the TDS.

Ceramic conversion

Converts to SiCN, SiCNO or SiO2 ceramics on curing.

Reactive chemistry

Si–H, Si–N and vinyl sites for crosslinking and modification.

Form flexibility

Liquids and solids across a viscosity and molecular-weight range.

High-temperature resistance

Service up to 700–1000 °C depending on grade.

Hardness

Cured films reach 3H–8H depending on grade.

Binder performance

Adhesion to metals, glass and ceramics.

Documents

Request the documents you need, or start a guided evaluation — everything is provided per product grade.

TDS — by product grade

Technical data for any grade in this family.

SDS — by product & country

Safety documentation in the required language.

Application Guide

Surface preparation, application and curing.

Sample

Material sample for qualified projects.

FAQ

Common questions about this material family.

How do the grades in this family differ?

The grades differ in temperature range and application profile — exact values are in each product TDS. Send your operating conditions and we will recommend a grade.

Can I test the material before committing to volume?

Yes — sample support is available for qualified B2B projects after a short technical review.

Which substrates are compatible?

Steel, stainless and other metals are typical. Compatibility for a specific substrate is confirmed per grade in the TDS.

How is this different from conventional high-temperature paint?

Silazane-derived coatings convert to a dense ceramic layer, designed for service beyond the range of conventional organic paints. Comparative data is available on request.

What is the minimum order quantity?

MOQ depends on the product and packaging format — to be confirmed with our team for your grade.

Send request

From first enquiry to qualified bulk supply — send your requirements below.

01

Send requirement

Application, substrate and performance target.

02

Get recommendation

Suitable material family and product grade.

03

Receive TDS/SDS, catalog & sample

Documentation and sample for evaluation.

04

Test material

Validate on your substrate and process.

05

Confirm & bulk supply

Specification agreement and ongoing supply.

About organic polysilazane resins

These resins are supplied as liquids or solids and are used both directly — as binders, varnishes and impregnation media — and as precursors that convert to SiCN, SiCNO and SiO2 ceramics on curing. Grade choice follows the target chemistry, viscosity and cure route.

Typical evaluation starts with the substrate, operating temperature and application process. Exact temperature limits, film thickness and curing parameters depend on the product grade and are confirmed in the TDS. Sample support is available for qualified B2B projects.