Electronics & Energy

Protect electronic components and energy systems against moisture, contamination and electrical leakage with polysilazane-based coating systems. We don’t promise a universal result — we recommend a specific material for your parts and operating environment, confirmed by documentation and a sample.

Recommended products

Proposed starting points — the final recommendation for your case follows technical review.

Potting Adhesive 250-500C

EK-M01

High-temperature encapsulation compound (250–500 °C)

EK-M01 grade for potting and encapsulation at 250–500 °C.

EK-M10 Silicone-Rubber-Modified Insulating Resin

EK-M10

High-toughness silicone-rubber-modified polysilazane resin (insulating, voltage-resistant)

One-component high-toughness insulating resin: ≥10⁵ V/mm; above 400–520 °C service.

EK-M102

Fluorine-modified polysilazane, 28–30% fluorine

Fluorine-modified polysilazane from the methyl trifluoropropyl series; 28–30% fluorine, water contact angle 105–110°.

EK-M103

Fluorine-modified polysilazane, 55–60% fluorine

Highest-fluorine grade in the range — 55–60% fluorine and a water contact angle of 110–120° for superhydrophobic surfaces.

EK-M14 Anti-Fingerprint Resin

EK-M14

Hydrophobic anti-fingerprint silicone-modified resin

Nanotech-functionalized polysilazane resin; anti-fingerprint applications.

EK-S03 Methylhydrogensilazane

EK-S03

High-temperature curing agent (methylhydrogen polysilazane)

Methylhydrogen polysilazane (MW >8×10⁴) — high-temperature curing agent and crosslinker.

EK-S04 Methylvinylsilazane

EK-S04

Methylvinylsilazane

Low-molecular silazane — amine curing agent and modifier for epoxy, alkyd, acrylic resins.

EK-S05 High-Molecular Polysilazane Binder

EK-S05

High-molecular polysilazane binder

Binder for steel coating systems; precursor for SiCN, SiCNO and SiO2 ceramics.

EK-S08 Solid Polysilazane Resin

EK-S08

Solid polysilazane resin, high-temperature curing

Solid resin for ceramic-precursor routes, flame-retardant systems and HT adhesives.

EK-S10 Polyamide-Polysilazane Resin

EK-S10

Polyaluminosilazane resin

Polyaluminosilazane resin; >75% ceramic yield, also for ceramic-precursor routes.

EK-S11 Low-Molecular Polysilazane

EK-S11

Low-molecular methylhydrogen polysilazane

Low-molecular polysilazane (MW 177–591) for composites, impregnation and thin films.

EK-S1503

Solvent-free flexible polysilazane resin

Solvent-free flexible polysilazane for coatings that must bend without cracking — plastics and wind turbine blades.

EK-S8002

Trimethyltrivinylcyclotrisilazane, CAS 5505-72-6

Vinyl-functional cyclic silazane monomer; trimer ≥95%, used as a battery electrolyte additive and polysilazane precursor.

EK-S8003

Hexamethyldisilazane (HMDS), CAS 999-97-3

Ultra-high-purity HMDS, assay ≥99.5% and chloride ≤10 ppm; silylating agent and photoresist adhesion promoter.

EK-S8004

Tetramethyldivinyldisilazane, CAS 7691-02-3

Vinyl-functional silazane monomer, assay ≥99.0% and chloride ≤10 ppm; filler modification for liquid silicone rubber.

EK-SiBCN

Boron-modified polysilazane for wave-transparent and 1700 °C coatings

Boron-modified polysilazane rated to 1700 °C with wave-transparent properties and high-temperature self-healing; two viscosity grades.

Perhydropolysilazane PHPS

PHPS

Perhydropolysilazane

Inorganic polysilazane precursor forming pure SiO2 / glass-ceramic layers.

Polycarbosilane PCS

Polycarbosilane

Polycarbosilane (PCS)

Preceramic precursor for silicon carbide ceramics and SiC fibers.

Silicon Carbide Fibers

SiC Fibers

Continuous silicon carbide fibers

Continuous SiC fiber for high-temperature composite reinforcement.

The challenge

Recognise your situation — and what it costs when protection fails.

Moisture, contamination and heat stress sensitive electronics and energy systems continuously. When a protective layer fails, the cost is not just rework — it is field returns, component replacement and reliability risk.

Conventional conformal coatings have limits under heat and humidity. Silazane-based systems form a dense, thin protective layer designed for longer service in these conditions — the right grade and film build are confirmed during technical review.

Typical situations

Humid and condensing environments — moisture and contamination

High-density electronics — electrical leakage and shorting

Power modules and semiconductors under thermal load

Batteries, connectors and energy storage systems

How the protection works

Ceramic protection layer

Dense barrier against moisture and contamination

Polysilazane layer

Adhesion, curing and surface conversion

Substrate

Silicon, metal, ceramic or polymer surface

Requirements

Properties that matter for electronics and energy protection — availability depends on product grade and is confirmed in the TDS.

Barrier against moisture

Thin dense film limiting moisture and contamination ingress.

Electrical insulation

Dielectric behaviour supporting electrical isolation — per grade.

Adhesion to substrates

Reliable bonding to prepared electronic substrates.

Thin uniform films

Even coverage over fine features and edges.

Thermal stability

Where operating heat is part of the environment.

Long-term durability

Designed for extended service — validated on your parts.

Substrates & industries

Where these systems are typically applied. Compatibility is confirmed per grade — not guaranteed generically.

Typical substrates

Silicon and semiconductor dies

Metal contacts and connectors

Ceramic and glass substrates

Prepared / primed surfaces per guide

Typical industries

Consumer and industrial electronics

Power electronics and modules

Batteries and energy storage

EV and e-mobility systems

Documents

Everything is provided per product grade, on request.

TDS

Technical data per grade.

SDS

Safety data by country & language.

Application Guide

Preparation, application, curing.

Sample

For qualified B2B projects.

FAQ

Common questions about electronics and energy coating projects.

Can the coating be applied over populated boards and components?

Surface preparation and masking requirements are defined in the Application Guide. The condition of your parts is assessed during technical review.

How is this different from a conventional conformal coating?

Silazane-based systems form a dense, thin ceramic-like layer designed for demanding electronic environments. Comparative data for a specific grade is available on request.

How long will the protection last?

Service life depends on the operating environment, film build and application quality — we validate it on your parts through sample testing rather than promising generic numbers.

Which product should I start with?

Send your components, operating environment and process — our team will recommend a grade and provide the TDS. Custom formulation is possible subject to technical review.

Can I test before committing to volume?

Yes — sample support is available for qualified B2B projects after a short technical review.

What about MOQ and pricing?

Both depend on the grade, packaging and volume — include your estimated quantity in the request and a quotation follows the technical review.

Send request

From first enquiry to qualified bulk supply — send your requirements below.

01

Send requirement

Application, substrate and performance target.

02

Get recommendation

Suitable material family and product grade.

03

Receive TDS/SDS, catalog & sample

Documentation and sample for evaluation.

04

Test material

Validate on your substrate and process.

05

Confirm & bulk supply

Specification agreement and ongoing supply.

About electronics & energy

Electronics and energy coatings protect components and power systems against moisture, contamination and heat. Polysilazane-based systems form a dense, thin protective layer with electrical insulation for demanding service conditions.

Product selection depends on the components, operating environment and application process. Technical data sheets, application guides and sample support are provided on request for each product grade.